Senba SensingStock Code：300701Focus on PIR R&D manufacturing over 19years
Senba SensingStock Code：300701Focus on PIR R&D manufacturing over 19years
Center wavelength: 3375±50nm T>80%
Half width:160±20nm
Cut-off band except passband: 1-11um Tave<0.5%
Substrate: Silicon
Diameter: 100.00mm±0.50mm
Thickness: 0.5mm ± 0.05mm
(Base 、diameter、 thickness can be customized）
HC
PROD Model | Cutoff Wavelength（um） | Transmittance | Base | Cutoff | Diameter（mm） | Thickness（mm） | Gas application | |
Range（nm） | Average Value（%） | Cutoff Depth（%） | ||||||
NBP3375-160nm | 1-11um | 3375±50nm | T＞80% | Silicon、germanium sapphire and so on | Tave＜0.5% | 100±0.5mm | 0.5±0.05mm | HC |
Product spectrogram
